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2UUL BH17 CPU Reballing Platform with iPhone A10-A19/Android Stencil
Le prix initial était : 34,71 €.27,76 €Le prix actuel est : 27,76 €.
2UUL BH17 CPUREBALL BASE Magnetic Dual-sided Reballing Platform with A10-A19 Pro Exynos Qualcomm MTK Hisilicon EMMC RAM Stencil for iPhone 7-17 Pro Max and Android Phone repair. Double-sided solder balls, two thicknesses, with built-in strong magnets, allow for quick and precise CPU installation, ensuring no displacement during soldering. Suitable for repairing various mobile phone CPUs. Feature:1. Double-sided solder ball design: Supports two different solder ball sizes simultaneously, suitable for repairing CPUs in both Apple and Android devices.2. Two thickness options: Offers two solder ball thicknesses: T0.6 (for Apple devices) and T0.35 (for Android devices), meeting the soldering requirements of different…
Description
2UUL BH17 CPUREBALL BASE Magnetic Dual-sided Reballing Platform with A10-A19 Pro Exynos Qualcomm MTK Hisilicon EMMC RAM Stencil for iPhone 7-17 Pro Max and Android Phone repair. Double-sided solder balls, two thicknesses, with built-in strong magnets, allow for quick and precise CPU installation, ensuring no displacement during soldering. Suitable for repairing various mobile phone CPUs.
Feature:
1. Double-sided solder ball design: Supports two different solder ball sizes simultaneously, suitable for repairing CPUs in both Apple and Android devices.
2. Two thickness options: Offers two solder ball thicknesses: T0.6 (for Apple devices) and T0.35 (for Android devices), meeting the soldering requirements of different CPU models.
3. Strong magnets: Built-in strong magnets ensure stable CPU fixation and prevent displacement during soldering.
4. Precision Soldering: Provides a precise soldering platform, ensuring even distribution of solder balls and perfect CPU alignment.
5. Wide Applicability: Particularly suitable for multiple mainstream mobile phone CPU models such as the SM8750 Snapdragon 8 Ultra, A19 Pro, and A19.
6. Compact and Convenient: Compact design, suitable for use by repair personnel in limited spaces, easy to carry and store.
CPU stencil models (75pcs):
1. For iPhone 7-17 Pro Max (12pcs):
– A19 Pro
– A19
– A18 Pro
– A18
– A17
– A16
– A15
– A14
– A13
– A12
– A11
– A10
2. Qualcomm series (17pcs):
– SM8750
– SM8450
– SM8150
– SM7325
– SM7125
– SM8650
– SM8350
– SM7550
– SM7250
– SM8550
– SM7150
– SM7450
– SM8475/SM7475
– SM8250-102
– SM7350
– SM8250-002
– SM7225-00AB
3. HiSilicon series (9pcs):
– Hi36C0
– Hi36A0
– Hi3690-5G
– Hi3690-4G
– Hi3680
– Hi6280
– Hi6290/L
– Hi3640
– Hi3670
4. Exynos series (11pcs):
– Exynos 2200
– Exynos 2100
– Exynos 9820
– Exynos 980
– Exynos 8895
– Exynos 1480-E8845
– Exynos 1330-E8535P
– Exynos 990
– Exynos 1380-E8835P
– Exynos 1280-E8825
– Exynos 9815/1080
5. MTK series (14pcs):
– MT6989W
– MT6985W
– MT6895Z
– MT6897Z
– MT6855V
– MT6877V
– MT6853V
– MT8781/MT6789V
– MT6983Z
– MT6761V/6762V/6765
– MT6885Z
– MT6833V
– MT6873V/6875V
– MT6891Z/6893Z
6. EMMC+RAM series (12pcs):
– BGA 254
– BGA 186
– BGA 169
– BGA 162
– BGA 134
– BGA 556
– BGA 436
– BGA 376
– BGA 178
– BGA 496
– BGA 153
– BGA 221
Product Parameters:
Product Name: BH17 CPUREBALL BASE Magnetic Dual-Sided Reballing Platform Set for Phone CPU
Gross Weight: 266g
Net Weight: 238g
Product Dimensions: 58x58x11mm
Packaging Dimensions: 64.5×64.5×34.5mm
Product Parameters:
Product Name: BH17 CPUREBALL BASE Magnetic Dual-Sided Reballing Platform Set for Phone CPU
Gross Weight: 266g
Net Weight: 238g
Product Dimensions: 58x58x11mm
Packaging Dimensions: 64.5×64.5×34.5mm
Informations complémentaires
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